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Nanophotonics Oct 2023Tunable nanophotonic metastructures offer new capabilities in computing, networking, and imaging by providing reconfigurability in computer interconnect topologies, new... (Review)
Review
Tunable nanophotonic metastructures offer new capabilities in computing, networking, and imaging by providing reconfigurability in computer interconnect topologies, new optical information processing capabilities, optical network switching, and image processing. Depending on the materials and the nanostructures employed in the nanophotonic metastructure devices, various tuning mechanisms can be employed. They include thermo-optical, electro-optical (e.g. Pockels and Kerr effects), magneto-optical, ionic-optical, piezo-optical, mechano-optical (deformation in MEMS or NEMS), and phase-change mechanisms. Such mechanisms can alter the real and/or imaginary parts of the optical susceptibility tensors, leading to tuning of the optical characteristics. In particular, tunable nanophotonic metastructures with relatively large tuning strengths (e.g. large changes in the refractive index) can lead to particularly useful device applications. This paper reviews various tunable nanophotonic metastructures' tuning mechanisms, tuning characteristics, tuning speeds, and non-volatility. Among the reviewed tunable nanophotonic metastructures, some of the phase-change-mechanisms offer relatively large index change magnitude while offering non-volatility. In particular, Ge-Sb-Se-Te (GSST) and vanadium dioxide (VO) materials are popular for this reason. Mechanically tunable nanophotonic metastructures offer relatively small changes in the optical losses while offering large index changes. Electro-optically tunable nanophotonic metastructures offer relatively fast tuning speeds while achieving relatively small index changes. Thermo-optically tunable nanophotonic metastructures offer nearly zero changes in optical losses while realizing modest changes in optical index at the expense of relatively large power consumption. Magneto-optically tunable nanophotonic metastructures offer non-reciprocal optical index changes that can be induced by changing the magnetic field strengths or directions. Tunable nanophotonic metastructures can find a very wide range of applications including imaging, computing, communications, and sensing. Practical commercial deployments of these technologies will require scalable, repeatable, and high-yield manufacturing. Most of these technology demonstrations required specialized nanofabrication tools such as e-beam lithography on relatively small fractional areas of semiconductor wafers, however, with advanced CMOS fabrication and heterogeneous integration techniques deployed for photonics, scalable and practical wafer-scale fabrication of tunable nanophotonic metastructures should be on the horizon, driven by strong interests from multiple application areas.
PubMed: 38013926
DOI: 10.1515/nanoph-2023-0034 -
Frontiers in Neuroscience 2023Resistive random access memory is very well known for its potential application in in-memory and neural computing. However, they often have different types of... (Review)
Review
Resistive random access memory is very well known for its potential application in in-memory and neural computing. However, they often have different types of device-to-device and cycle-to-cycle variability. This makes it harder to build highly accurate crossbar arrays. Traditional RRAM designs make use of various filament-based oxide materials for creating a channel that is sandwiched between two electrodes to form a two-terminal structure. They are often subjected to mechanical and electrical stress over repeated read-and-write cycles. The behavior of these devices often varies in practice across wafer arrays over these stresses when fabricated. The use of emerging 2D materials is explored to improve electrical endurance, long retention time, high switching speed, and fewer power losses. This study provides an in-depth exploration of neuro-memristive computing and its potential applications, focusing specifically on the utilization of graphene and 2D materials in RRAM for neural computing. The study presents a comprehensive analysis of the structural and design aspects of graphene-based RRAM, along with a thorough examination of commercially available RRAM models and their fabrication techniques. Furthermore, the study investigates the diverse range of applications that can benefit from graphene-based RRAM devices.
PubMed: 37886675
DOI: 10.3389/fnins.2023.1253075 -
Sensors (Basel, Switzerland) Oct 2023This paper studies the AWC (Active Wafer Centering) algorithm for the movement control and wafer calibration of the handling robot in semiconductor manufacturing to...
This paper studies the AWC (Active Wafer Centering) algorithm for the movement control and wafer calibration of the handling robot in semiconductor manufacturing to prevent wafer surface contact and contamination during the transfer process. The mechanical and software architecture of the wafer-handling robot is analyzed first, which is followed by a description of the experimental platform for semiconductor manufacturing methods. Secondly, the article utilizes the geometric method to analyze the kinematics of the semiconductor robot, and it decouples the motion control of the robot body from the polar coordinates and joint space. The wafer center position is calibrated using the generalized least-square inverse method for AWC correction. The AWC algorithm is divided into calibration, deviation correction, and retraction detection. These are determined by analyzing the robot's wafer calibration process. In conclusion, the semiconductor robot's motion control and AWC algorithm are verified through experiments for correctness, feasibility, and effectiveness. After the wafer correction, the precision of AWC is <± 0.15 mm, which meets the requirements for transferring robot wafers.
PubMed: 37896595
DOI: 10.3390/s23208502 -
Micromachines Sep 2023Traditional goal of microfabrication was to limitedly construct nano- and micro-geometries on silicon or quartz wafers using various semiconductor manufacturing... (Review)
Review
Traditional goal of microfabrication was to limitedly construct nano- and micro-geometries on silicon or quartz wafers using various semiconductor manufacturing technologies, such as photolithography, soft lithography, etching, deposition, and so on. However, recent integration with biotechnologies has led to a wide expansion of microfabrication. In particular, many researchers studying pharmacology and pathology are very interested in producing in vitro models that mimic the actual intestine to study the effectiveness of new drug testing and interactions between organs. Various bio-microfabrication techniques have been developed while solving inherent problems when developing in vitro micromodels that mimic the real large intestine. This intensive review introduces various bio-microfabrication techniques that have been used, until recently, to realize two-dimensional and three-dimensional biomimetic experimental models. Regarding the topic of gut chips, two major review subtopics and two-dimensional and three-dimensional gut chips were employed, focusing on the membrane-based manufacturing process for two-dimensional gut chips and the scaffold-based manufacturing process for three-dimensional gut chips, respectively.
PubMed: 37763899
DOI: 10.3390/mi14091736 -
Microsystems & Nanoengineering 2023We introduce an imaging system that can simultaneously record complete Mueller polarization responses for a set of wavelength channels in a single image capture. The...
We introduce an imaging system that can simultaneously record complete Mueller polarization responses for a set of wavelength channels in a single image capture. The division-of-focal-plane concept combines a multiplexed illumination scheme based on Fourier optics together with an integrated telescopic light-field imaging system. Polarization-resolved imaging is achieved using broadband nanostructured plasmonic polarizers as functional pinhole apertures. The recording of polarization and wavelength information on the image sensor is highly interpretable. We also develop a calibration approach based on a customized neural network architecture that can produce calibrated measurements in real-time. As a proof-of-concept demonstration, we use our calibrated system to accurately reconstruct a thin film thickness map from a four-inch wafer. We anticipate that our concept will have utility in metrology, machine vision, computational imaging, and optical computing platforms.
PubMed: 37814609
DOI: 10.1038/s41378-023-00588-y -
Scientific Reports May 2024The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabrication processes being demonstrated...
The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabrication processes being demonstrated at both infrared and visible wavelengths. However, these demonstrations have primarily focused on fabrication processes on silicon substrates that result in rigid photonic wafers and chips, which limit the potential application spaces. There are many application areas that would benefit from mechanically-flexible integrated-photonics wafers, such as wearable healthcare monitors and pliable displays. Although there have been demonstrations of mechanically-flexible photonics fabrication, they have been limited to fabrication processes on the individual device or chip scale, which limits scalability. In this paper, we propose, develop, and experimentally characterize the first 300-mm wafer-scale platform and fabrication process that results in mechanically-flexible photonic wafers and chips. First, we develop and describe the 300-mm wafer-scale CMOS-compatible flexible platform and fabrication process. Next, we experimentally demonstrate key optical functionality at visible wavelengths, including chip coupling, waveguide routing, and passive devices. Then, we perform a bend-durability study to characterize the mechanical flexibility of the photonic chips, demonstrating bending a single chip 2000 times down to a bend diameter of 0.5 inch with no degradation in the optical performance. Finally, we experimentally characterize polarization-rotation effects induced by bending the flexible photonic chips. This work will enable the field of integrated photonics to advance into new application areas that require flexible photonic chips.
PubMed: 38724580
DOI: 10.1038/s41598-024-61055-w -
Micromachines Jul 2023Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production... (Review)
Review
Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.
PubMed: 37630048
DOI: 10.3390/mi14081512 -
Nature Communications Apr 2024Chip-scale integration is a key enabler for the deployment of photonic technologies. Coherent laser ranging or FMCW LiDAR, a perception technology that benefits from...
Chip-scale integration is a key enabler for the deployment of photonic technologies. Coherent laser ranging or FMCW LiDAR, a perception technology that benefits from instantaneous velocity and distance detection, eye-safe operation, long-range, and immunity to interference. However, wafer-scale integration of these systems has been challenged by stringent requirements on laser coherence, frequency agility, and the necessity for optical amplifiers. Here, we demonstrate a photonic-electronic LiDAR source composed of a micro-electronic-based high-voltage arbitrary waveform generator, a hybrid photonic circuit-based tunable Vernier laser with piezoelectric actuators, and an erbium-doped waveguide amplifier. Importantly, all systems are realized in a wafer-scale manufacturing-compatible process comprising III-V semiconductors, silicon nitride photonic integrated circuits, and 130-nm SiGe bipolar complementary metal-oxide-semiconductor (CMOS) technology. We conducted ranging experiments at a 10-meter distance with a precision level of 10 cm and a 50 kHz acquisition rate. The laser source is turnkey and linearization-free, and it can be seamlessly integrated with existing focal plane and optical phased array LiDAR approaches.
PubMed: 38605067
DOI: 10.1038/s41467-024-47478-z -
Expert Opinion on Investigational Drugs 2023Glioblastoma, isocitrate dehydrogenase wildtype (IDHwt), remains an incurable disease despite considerable research effort. The current standard of care since 2005... (Review)
Review
INTRODUCTION
Glioblastoma, isocitrate dehydrogenase wildtype (IDHwt), remains an incurable disease despite considerable research effort. The current standard of care since 2005 comprises maximal safe resection followed by radiation with concurrent and adjuvant temozolomide; more recently, the addition of tumor treating fields was approved in the newly diagnosed and recurrent disease settings.
AREAS COVERED
Searches of PubMed, Cochrane Library, and ClinicalTrials.gov provided a foundation for this review. We first describe early research including carmustine wafers, brachytherapy, anti-angiogenesis, and immune checkpoint inhibition for glioblastoma. Next, we discuss challenges precluding the translation of preclinical successes. This is followed by a description of promising treatments such as chimeric antigen receptor T-cell therapy as well as the recent qualified successes of cancer vaccinations. Non-immunotherapy trials are also highlighted, and ongoing or pending phase 2 and 3 clinical trials are codified in study tables.
EXPERT OPINION
Unfortunately, hundreds of trials, including of agents effective in systemic malignancy, have not drastically changed management of glioblastoma. This may reflect unique resistance mechanisms and highlights a need for multimodality treatments beyond surgery, radiation, and conventional chemotherapy. Novel techniques, such as those in the emerging field of cancer neuroscience, may help uncover tolerable and effective regimens for this lethal malignancy.
Topics: Humans; Glioblastoma; Brain Neoplasms; Temozolomide; Combined Modality Therapy; Therapies, Investigational
PubMed: 37796104
DOI: 10.1080/13543784.2023.2267982