Did you mean: wafers
-
National Science Review Apr 2020Mechanically exfoliated two-dimensional ferromagnetic materials (2D FMs) possess long-range ferromagnetic order and topologically nontrivial skyrmions in few layers....
Mechanically exfoliated two-dimensional ferromagnetic materials (2D FMs) possess long-range ferromagnetic order and topologically nontrivial skyrmions in few layers. However, because of the dimensionality effect, such few-layer systems usually exhibit much lower Curie temperature ( ) compared to their bulk counterparts. It is therefore of great interest to explore effective approaches to enhance their , particularly in wafer-scale for practical applications. Here, we report an interfacial proximity-induced high- 2D FM FeGeTe (FGT) via A-type antiferromagnetic material CrSb (CS) which strongly couples to FGT. A superlattice structure of (FGT/CS), where stands for the period of FGT/CS heterostructure, has been successfully produced with sharp interfaces by molecular-beam epitaxy on 2-inch wafers. By performing elemental specific X-ray magnetic circular dichroism (XMCD) measurements, we have unequivocally discovered that of 4-layer FeGeTe can be significantly enhanced from 140 K to 230 K because of the interfacial ferromagnetic coupling. Meanwhile, an inverse proximity effect occurs in the FGT/CS interface, driving the interfacial antiferromagnetic CrSb into a ferrimagnetic state as evidenced by double-switching behavior in hysteresis loops and the XMCD spectra. Density functional theory calculations show that the Fe-Te/Cr-Sb interface is strongly FM coupled and doping of the spin-polarized electrons by the interfacial Cr layer gives rise to the enhancement of the FeGeTe films, in accordance with our XMCD measurements. Strikingly, by introducing rich Fe in a 4-layer FGT/CS superlattice, can be further enhanced to near room temperature. Our results provide a feasible approach for enhancing the magnetic order of few-layer 2D FMs in wafer-scale and render opportunities for realizing realistic ultra-thin spintronic devices.
PubMed: 34692093
DOI: 10.1093/nsr/nwz205 -
Nanophotonics Oct 2023Tunable nanophotonic metastructures offer new capabilities in computing, networking, and imaging by providing reconfigurability in computer interconnect topologies, new... (Review)
Review
Tunable nanophotonic metastructures offer new capabilities in computing, networking, and imaging by providing reconfigurability in computer interconnect topologies, new optical information processing capabilities, optical network switching, and image processing. Depending on the materials and the nanostructures employed in the nanophotonic metastructure devices, various tuning mechanisms can be employed. They include thermo-optical, electro-optical (e.g. Pockels and Kerr effects), magneto-optical, ionic-optical, piezo-optical, mechano-optical (deformation in MEMS or NEMS), and phase-change mechanisms. Such mechanisms can alter the real and/or imaginary parts of the optical susceptibility tensors, leading to tuning of the optical characteristics. In particular, tunable nanophotonic metastructures with relatively large tuning strengths (e.g. large changes in the refractive index) can lead to particularly useful device applications. This paper reviews various tunable nanophotonic metastructures' tuning mechanisms, tuning characteristics, tuning speeds, and non-volatility. Among the reviewed tunable nanophotonic metastructures, some of the phase-change-mechanisms offer relatively large index change magnitude while offering non-volatility. In particular, Ge-Sb-Se-Te (GSST) and vanadium dioxide (VO) materials are popular for this reason. Mechanically tunable nanophotonic metastructures offer relatively small changes in the optical losses while offering large index changes. Electro-optically tunable nanophotonic metastructures offer relatively fast tuning speeds while achieving relatively small index changes. Thermo-optically tunable nanophotonic metastructures offer nearly zero changes in optical losses while realizing modest changes in optical index at the expense of relatively large power consumption. Magneto-optically tunable nanophotonic metastructures offer non-reciprocal optical index changes that can be induced by changing the magnetic field strengths or directions. Tunable nanophotonic metastructures can find a very wide range of applications including imaging, computing, communications, and sensing. Practical commercial deployments of these technologies will require scalable, repeatable, and high-yield manufacturing. Most of these technology demonstrations required specialized nanofabrication tools such as e-beam lithography on relatively small fractional areas of semiconductor wafers, however, with advanced CMOS fabrication and heterogeneous integration techniques deployed for photonics, scalable and practical wafer-scale fabrication of tunable nanophotonic metastructures should be on the horizon, driven by strong interests from multiple application areas.
PubMed: 38013926
DOI: 10.1515/nanoph-2023-0034 -
Sensors (Basel, Switzerland) Oct 2023This paper studies the AWC (Active Wafer Centering) algorithm for the movement control and wafer calibration of the handling robot in semiconductor manufacturing to...
This paper studies the AWC (Active Wafer Centering) algorithm for the movement control and wafer calibration of the handling robot in semiconductor manufacturing to prevent wafer surface contact and contamination during the transfer process. The mechanical and software architecture of the wafer-handling robot is analyzed first, which is followed by a description of the experimental platform for semiconductor manufacturing methods. Secondly, the article utilizes the geometric method to analyze the kinematics of the semiconductor robot, and it decouples the motion control of the robot body from the polar coordinates and joint space. The wafer center position is calibrated using the generalized least-square inverse method for AWC correction. The AWC algorithm is divided into calibration, deviation correction, and retraction detection. These are determined by analyzing the robot's wafer calibration process. In conclusion, the semiconductor robot's motion control and AWC algorithm are verified through experiments for correctness, feasibility, and effectiveness. After the wafer correction, the precision of AWC is <± 0.15 mm, which meets the requirements for transferring robot wafers.
PubMed: 37896595
DOI: 10.3390/s23208502 -
Micromachines Aug 2021Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes,... (Review)
Review
Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart Cut process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.
PubMed: 34442568
DOI: 10.3390/mi12080946 -
Sensors (Basel, Switzerland) Oct 2016The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for... (Review)
Review
The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.
PubMed: 27809249
DOI: 10.3390/s16111819 -
British Journal of Clinical Pharmacology Apr 2021This study investigated the safety, tolerability and pharmacokinetics after administration of a specific Cannabis sativa cultivar extract, standardised to cannabidiol... (Randomized Controlled Trial)
Randomized Controlled Trial
A phase I trial of the safety, tolerability and pharmacokinetics of cannabidiol administered as single-dose oil solution and single and multiple doses of a sublingual wafer in healthy volunteers.
AIMS
This study investigated the safety, tolerability and pharmacokinetics after administration of a specific Cannabis sativa cultivar extract, standardised to cannabidiol (CBD) content as sublingual wafer or oil formulation compared to nabiximols oromucosal spray.
METHODS
For the single-dose study, the design was an open-label, 4-way crossover in 12 healthy volunteers randomised to receive a sequence of 4 different single doses of CBD as a sublingual wafer (25 or 50 mg CBD), oil solution (50 mg CBD), or nabiximols oromucosal spray (20 mg CBD, 21.6 mg tetrahydrocannabinol). For the multiple-dose study, sublingual wafer (50 mg CBD) was administered twice a day for 5 days.
RESULTS
The extract was generally well tolerated by participants when administered in either wafer or oil form, with some adverse events, including mild or moderate somnolence, sedation and altered mood. The relative bioavailability of CBD after administration as a sublingual wafer was comparable with that of oil solution with 90% confidence interval of 83-131%. The median maximum concentrations of CBD after administration of oil solution and wafer was 9.4 and 11.9 ng mL , respectively. Maximum concentrations of CBD occurred 4 hours after administration, with an estimated terminal elimination half-life of 6 hours. There was no statistically significant difference between the AUC of CBD after administration of oil solution or wafer compared with nabiximols oromucosal spray.
CONCLUSION
Oil solution and sublingual wafer formulations of the extract standardised with CBD were well tolerated and achieved equivalent concentrations of CBD when compared to an available commercial nabiximols formulation.
Topics: Administration, Sublingual; Biological Availability; Cannabidiol; Cross-Over Studies; Healthy Volunteers; Humans
PubMed: 33075170
DOI: 10.1111/bcp.14617 -
Pharmaceutics Oct 2021Eye injuries due to corneal abrasions, chemical spills, penetrating wounds, and microbial infections cause corneal scarring and opacification that result in impaired...
Eye injuries due to corneal abrasions, chemical spills, penetrating wounds, and microbial infections cause corneal scarring and opacification that result in impaired vision or blindness. However, presently available eye drop formulations of anti-inflammatory and antibiotic drugs are not effective due to their rapid clearance from the ocular surface or due to drug-related side effects such as cataract formation or increased intraocular pressure. In this article, we presented the development of a dextran sulfate-based polymer wafer (DS-wafer) for the effective modulation of inflammation and fibrosis and demonstrated its efficacy in two corneal injury models: corneal abrasion mouse model and alkali induced ocular burn mouse model. The DS-wafers were fabricated by the electrospinning method. We assessed the efficacy of the DS-wafer by light microscopy, qPCR, confocal fluorescence imaging, and histopathological analysis. These studies demonstrated that the DS-wafer treatment is significantly effective in modulating corneal inflammation and fibrosis and inhibited corneal scarring and opacification compared to the unsulfated dextran-wafer treated and untreated corneas. Furthermore, these studies have demonstrated the efficacy of dextran sulfate as an anti-inflammatory and antifibrotic polymer therapeutic.
PubMed: 34683921
DOI: 10.3390/pharmaceutics13101628 -
Micromachines Oct 2022Chemical mechanical polishing (CMP) is a well-known technology that can produce surfaces with outstanding global planarization without subsurface damage. A good CMP... (Review)
Review
Chemical mechanical polishing (CMP) is a well-known technology that can produce surfaces with outstanding global planarization without subsurface damage. A good CMP process for Silicon Carbide (SiC) requires a balanced interaction between SiC surface oxidation and the oxide layer removal. The oxidants in the CMP slurry control the surface oxidation efficiency, while the polishing mechanical force comes from the abrasive particles in the CMP slurry and the pad asperity, which is attributed to the unique pad structure and diamond conditioning. To date, to obtain a high-quality as-CMP SiC wafer, the material removal rate (MRR) of SiC is only a few micrometers per hour, which leads to significantly high operation costs. In comparison, conventional Si CMP has the MRR of a few micrometers per minute. To increase the MRR, improving the oxidation efficiency of SiC is essential. The higher oxidation efficiency enables the higher mechanical forces, leading to a higher MRR with better surface quality. However, the disparity on the Si-face and C-face surfaces of 4H- or 6H-SiC wafers greatly increases the CMP design complexity. On the other hand, integrating hybrid energies into the CMP system has proven to be an effective approach to enhance oxidation efficiency. In this review paper, the SiC wafering steps and their purposes are discussed. A comparison among the three configurations of SiC CMP currently used in the industry is made. Moreover, recent advances in CMP and hybrid CMP technologies, such as Tribo-CMP, electro-CMP (ECMP), Fenton-ECMP, ultrasonic-ECMP, photocatalytic CMP (PCMP), sulfate-PCMP, gas-PCMP and Fenton-PCMP are reviewed, with emphasis on their oxidation behaviors and polishing performance. Finally, we raise the importance of post-CMP cleaning and make a summary of the various SiC CMP technologies discussed in this work.
PubMed: 36296105
DOI: 10.3390/mi13101752 -
Scientific Reports Dec 2022High traffic touch surfaces such as doorknobs, countertops, and handrails can be transmission points for the spread of pathogens, emphasizing the need to develop...
High traffic touch surfaces such as doorknobs, countertops, and handrails can be transmission points for the spread of pathogens, emphasizing the need to develop materials that actively self-sanitize. Metals are frequently used for these surfaces due to their durability, but many metals also possess antimicrobial properties which function through a variety of mechanisms. This work investigates metallic alloys comprised of several metals which individually possess antimicrobial properties, with the target of achieving broad-spectrum, rapid sanitation through synergistic activity. An entropy-motivated stabilization paradigm is proposed to prepare scalable alloys of copper, silver, nickel and cobalt. Using combinatorial sputtering, thin-film alloys were prepared on 100 mm wafers with ≈50% compositional grading of each element across the wafer. The films were then annealed and investigated for alloy stability. Antimicrobial activity testing was performed on both the as-grown alloys and the annealed films using four microorganisms-Phi6, MS2, Bacillus subtilis and Escherichia coli-as surrogates for human viral and bacterial pathogens. Testing showed that after 30 s of contact with some of the test alloys, Phi6, an enveloped, single-stranded RNA bacteriophage that serves as a SARS-CoV-2 surrogate, was reduced up to 6.9 orders of magnitude (> 99.9999%). Additionally, the non-enveloped, double-stranded DNA bacteriophage MS2, and the Gram-negative E. coli and Gram-positive B. subtilis bacterial strains showed a 5.0, 6.4, and 5.7 log reduction in activity after 30, 20 and 10 min, respectively. Antimicrobial activity in the alloy samples showed a strong dependence on the composition, with the log reduction scaling directly with the Cu content. Concentration of Cu by phase separation after annealing improved activity in some of the samples. The results motivate a variety of themes which can be leveraged to design ideal antimicrobial surfaces.
Topics: Humans; Alloys; Escherichia coli; COVID-19; SARS-CoV-2; Anti-Infective Agents
PubMed: 36503913
DOI: 10.1038/s41598-022-25122-4 -
Optics Express Nov 2010Most demonstrations in silicon photonics are done with single devices that are targeted for use in future systems. One of the costs of operating multiple devices...
Most demonstrations in silicon photonics are done with single devices that are targeted for use in future systems. One of the costs of operating multiple devices concurrently on a chip in a system application is the power needed to properly space resonant device frequencies on a system's frequency grid. We asses this power requirement by quantifying the source and impact of process induced resonant frequency variation for microdisk resonators across individual die, entire wafers and wafer lots for separate process runs. Additionally we introduce a new technique, utilizing the Transverse Electric (TE) and Transverse Magnetic (TM) modes in microdisks, to extract thickness and width variations across wafers and dice. Through our analysis we find that a standard six inch Silicon on Insulator (SOI) 0.35 μm process controls microdisk resonant frequencies for the TE fundamental resonances to within 1 THz across a wafer and 105 GHz within a single die. Based on demonstrated thermal tuner technology, a stable manufacturing process exhibiting this level of variation can limit the resonance trimming power per resonant device to 231 μW. Taken in conjunction with the power to compensate for thermal environmental variations, the expected power requirement to compensate for fabrication-induced non-uniformities is 17% of that total. This leads to the prediction that thermal tuning efficiency is likely to have the most dominant impact on the overall power budget of silicon photonics resonator technology.
PubMed: 21164704
DOI: 10.1364/OE.18.023598