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Micromachines Aug 2021Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes,... (Review)
Review
Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart Cut process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.
PubMed: 34442568
DOI: 10.3390/mi12080946 -
Sensors (Basel, Switzerland) Oct 2016The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for... (Review)
Review
The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.
PubMed: 27809249
DOI: 10.3390/s16111819 -
Neuro-Chirurgie Dec 2017There is a growing body of evidence that carmustine wafer implantation during surgery is an effective therapeutic adjunct to the standard combined radio-chemotherapy... (Review)
Review
Carmustine wafer implantation for high-grade gliomas: Evidence-based safety efficacy and practical recommendations from the Neuro-oncology Club of the French Society of Neurosurgery.
There is a growing body of evidence that carmustine wafer implantation during surgery is an effective therapeutic adjunct to the standard combined radio-chemotherapy regimen using temozolomide in newly diagnosed and recurrent high-grade glioma patient management with a statistically significant survival benefit demonstrated across several randomized clinical trials, as well as prospective and retrospective studies (grade A recommendation). Compelling clinical data also support the safety of carmustine wafer implantation (grade A recommendation) in these patients and suggest that observed adverse events can be avoided in experienced neurosurgeon hands. Furthermore, carmustine wafer implantation does not seem to impact negatively on the quality of life and the completion of adjuvant oncological treatments (grade C recommendation). Moreover, emerging findings support the potential of high-grade gliomas molecular status, especially the O(6)-Methylguanine-DNA Methyltransferase promoter methylation status, in predicting the efficacy of such a surgical strategy, especially at recurrence (grade B recommendation). Finally, carmustine wafer implantation appears to be cost-effective in high-grade glioma patients when performed by an experienced team and when total or subtotal resection can be achieved. Altogether, these data underline the current need for a new randomized clinical trial to assess the impact of a maximal safe resection with carmustine wafer implantation followed by the standard combined chemoradiation protocol stratified by molecular status in high-grade glioma patients.
Topics: Antineoplastic Agents, Alkylating; Antineoplastic Combined Chemotherapy Protocols; Brain Neoplasms; Carmustine; Chemoradiotherapy; Combined Modality Therapy; Dacarbazine; Dosage Forms; Glioma; Humans; Neoplasm Recurrence, Local; Neurosurgical Procedures; Quality of Life; Randomized Controlled Trials as Topic; Temozolomide
PubMed: 29122306
DOI: 10.1016/j.neuchi.2017.07.003 -
Frontiers in Neuroscience 2023Wafer defect recognition is an important process of chip manufacturing. As different process flows can lead to different defect types, the correct identification of...
Wafer defect recognition is an important process of chip manufacturing. As different process flows can lead to different defect types, the correct identification of defect patterns is important for recognizing manufacturing problems and fixing them in good time. To achieve high precision identification of wafer defects and improve the quality and production yield of wafers, this paper proposes a Multi-Feature Fusion Perceptual Network (MFFP-Net) inspired by human visual perception mechanisms. The MFFP-Net can process information at various scales and then aggregate it so that the next stage can abstract features from the different scales simultaneously. The proposed feature fusion module can obtain higher fine-grained and richer features to capture key texture details and avoid important information loss. The final experiments show that MFFP-Net achieves good generalized ability and state-of-the-art results on real-world dataset WM-811K, with an accuracy of 96.71%, this provides an effective way for the chip manufacturing industry to improve the yield rate.
PubMed: 37332866
DOI: 10.3389/fnins.2023.1202985 -
Optics Express Aug 2020Thin-film lithium niobate (LN) photonic integrated circuits (PICs) could enable ultrahigh performance in electro-optic and nonlinear optical devices. To date,...
Thin-film lithium niobate (LN) photonic integrated circuits (PICs) could enable ultrahigh performance in electro-optic and nonlinear optical devices. To date, realizations have been limited to chip-scale proof-of-concepts. Here we demonstrate monolithic LN PICs fabricated on 4- and 6-inch wafers with deep ultraviolet lithography and show smooth and uniform etching, achieving 0.27 dB/cm optical propagation loss on wafer-scale. Our results show that LN PICs are fundamentally scalable and can be highly cost-effective.
PubMed: 32906986
DOI: 10.1364/OE.401959 -
Materials (Basel, Switzerland) May 2022Since the transfer process of graphene from a dedicated growth substrate to another substrate is prone to induce defects and contamination and can increase costs, there...
Since the transfer process of graphene from a dedicated growth substrate to another substrate is prone to induce defects and contamination and can increase costs, there is a large interest in methods for growing graphene directly on silicon wafers. Here, we demonstrate the direct CVD growth of graphene on a SiO layer on a silicon wafer by employing a Pt thin film as catalyst. We pattern the platinum film, after which a CVD graphene layer is grown at the interface between the SiO and the Pt. After removing the Pt, Raman spectroscopy demonstrates the local growth of monolayer graphene on SiO. By tuning the CVD process, we were able to fully cover 4-inch oxidized silicon wafers with transfer-free monolayer graphene, a result that is not easily obtained using other methods. By adding Ta structures, local graphene growth on SiO is selectively blocked, allowing the controlled graphene growth on areas selected by mask design.
PubMed: 35629749
DOI: 10.3390/ma15103723 -
Advanced Materials (Deerfield Beach,... Dec 2022The direct growth of graphene affording wafer-scale uniformity on insulators is paramount to electronic and optoelectronic applications; however, it remains a challenge...
The direct growth of graphene affording wafer-scale uniformity on insulators is paramount to electronic and optoelectronic applications; however, it remains a challenge to date, because it entails an entirely different growth mode than that over metals. Herein, the metal-catalyst-free growth of quasi-suspended graphene on a Si wafer is demonstrated using an interface-decoupling chemical vapor deposition strategy. The employment of lower-than-conventional H dosage and concurrent introduction of methanol during growth can effectively weaken the interaction between the synthesized graphene and the underlying substrate. The growth mode can be thus fine-tuned, producing a predominantly monolayer graphene film with wafer-level homogeneity. Graphene thus grown on a 4 inch Si wafer enables the transfer-free fabrication of high-performance graphene-based field-effect transistor arrays that exhibit almost no shift in the charge neutral point, indicating a quasi-suspended feature of the graphene. Moreover, a carrier mobility up to 15 000 cm V s can be attained. This study is anticipated to offer meaningful insights into the synthesis of wafer-scale high-quality graphene on dielectrics for practical graphene devices.
PubMed: 36208081
DOI: 10.1002/adma.202206389 -
Pharmaceutics Oct 2021Eye injuries due to corneal abrasions, chemical spills, penetrating wounds, and microbial infections cause corneal scarring and opacification that result in impaired...
Eye injuries due to corneal abrasions, chemical spills, penetrating wounds, and microbial infections cause corneal scarring and opacification that result in impaired vision or blindness. However, presently available eye drop formulations of anti-inflammatory and antibiotic drugs are not effective due to their rapid clearance from the ocular surface or due to drug-related side effects such as cataract formation or increased intraocular pressure. In this article, we presented the development of a dextran sulfate-based polymer wafer (DS-wafer) for the effective modulation of inflammation and fibrosis and demonstrated its efficacy in two corneal injury models: corneal abrasion mouse model and alkali induced ocular burn mouse model. The DS-wafers were fabricated by the electrospinning method. We assessed the efficacy of the DS-wafer by light microscopy, qPCR, confocal fluorescence imaging, and histopathological analysis. These studies demonstrated that the DS-wafer treatment is significantly effective in modulating corneal inflammation and fibrosis and inhibited corneal scarring and opacification compared to the unsulfated dextran-wafer treated and untreated corneas. Furthermore, these studies have demonstrated the efficacy of dextran sulfate as an anti-inflammatory and antifibrotic polymer therapeutic.
PubMed: 34683921
DOI: 10.3390/pharmaceutics13101628 -
Journal of Advanced Research Nov 2019A great number of patients have difficulty swallowing or needle fear. Therefore, buccal and orodispersible dosage forms (ODFs) represent an important strategy to enhance... (Review)
Review
A great number of patients have difficulty swallowing or needle fear. Therefore, buccal and orodispersible dosage forms (ODFs) represent an important strategy to enhance patient compliance. Besides not requiring water intake, swallowing or needles, these dosage forms allow drug release modulation. ODFs include oral lyophilizates or wafers, which present even faster disintegration than its compressed counterparts. Lyophilization can also produce buccal wafers that adhere to mucosa for sustained drug release. Due to the subject relevance and recent research growth, this review focused on oral lyophilizate production technology, formulation features, and therapy gains. It includes Critical Quality Attributes (CQA) and Critical Process Parameters (CPP) and discusses commercial and experimental examples. In sum, the available commercial products promote immediate drug release mainly based on biopolymeric matrixes and two production technologies. Therapy gains include substitution of traditional treatments depending on parenteral administration and patient preference over classical therapies. Experimental wafers show promising advantages as controlled release and drug enhanced stability. All compiled findings encourage the development of new wafers for several diseases and drug molecules.
PubMed: 31193385
DOI: 10.1016/j.jare.2019.04.010 -
International Journal of Oral and... Aug 2022Virtual surgical planning for orthognathic surgery using patient-specific implants (PSI) is usually waferless nowadays. However, without an occlusal wafer, difficulties...
Virtual surgical planning for orthognathic surgery using patient-specific implants (PSI) is usually waferless nowadays. However, without an occlusal wafer, difficulties arise in controlling the accuracy of multi-segment maxillary osteotomies, especially for expansion and rotational movements of each segment. It is technically challenging intraoperatively to manipulate multiple segments to fit into the PSI, as the relatively small bone segments need to be secured into the PSI while simultaneously achieving individual segment movements in all planes and with potential bony interferences with each other. Therefore, the use of a maxillary tooth-supported surgical guide is proposed and described. When the guide is inserted before the PSI, it overcomes difficulties in handling multiple maxillary segments and facilitates achieving maximal positional precision of each individual bone segment. The guide enables multiple smaller segments to behave as one unit with the designated occlusion whilst visualizing bony interferences before PSI plating is commenced. Adding a tooth-borne surgical guide in the form of a wafer and a customized arch bar is a cost-effective method to enhance accuracy in virtually planned multi-segment maxillary surgery. Further investigations are required to validate the accuracy and advantages of using wafers and PSI in multi-segment maxillary and mandibular orthognathic surgeries.
Topics: Dental Implants; Humans; Mandible; Maxilla; Orthognathic Surgery; Orthognathic Surgical Procedures; Osteotomy, Le Fort
PubMed: 35148911
DOI: 10.1016/j.ijom.2022.01.016